Process Burn In
Process test chamber for powered electronic components.
FULLY CUSTOMIZABLE
Process Burn In
Process test chamber for powered electronic components.
Clima & Thermotemperature range
From - 45° C to 200° C
Characteristics
Cold 
Hot 
Hot
Capacity
Options
Customizable according to your needs:
- Automatic or manual insertion and extraction system for the boards to be tested.
- Possibility of stacked ovens.
- Possibility to create connections from the interface board to power supplies and/or install a PC for controlling the driver board.
- Cooling with refrigeration unit or water for cycle time savings.
- Programming of thermal cycles with I/O customizable according to customer requirements.
- Customization of interface, BIB, and drivers.
Characteristics
Equipment designed to perform stress tests on electronic components, subjecting them to high temperatures, operating voltages, and power on/off cycles. The goal is to identify early failures and improve the long-term reliability of the devices. MSL is responsible for providing the oven and interfacing between the test board and the control board.
- Advanced control with high-performance PLC with PID regulation.
- Remotable graphical interface on PC or mobile device.
- Flexible communication: Modbus TCP standard, OPC UA, EtherCAT, and SQL.
- Secs-Gem Comunication to interface Host server with equipment HSMS comunication.
- Remote assistance with Ethernet or mobile connection, using a smartphone connected with USB.
- Data and alarm management with a dedicated FTP server for log saving.
- Automatic door closure.
Clima & Thermotemperature range
From - 45° C to 200° C
Characteristics
Cold
Hot
Hot
Capacity
Options
Customizable according to your needs:
- Automatic or manual insertion and extraction system for the boards to be tested.
- Possibility of stacked ovens.
- Possibility to create connections from the interface board to power supplies and/or install a PC for controlling the driver board.
- Cooling with refrigeration unit or water for cycle time savings.
- Programming of thermal cycles with I/O customizable according to customer requirements.
- Customization of interface, BIB, and drivers.
Characteristics
Equipment designed to perform stress tests on electronic components, subjecting them to high temperatures, operating voltages, and power on/off cycles. The goal is to identify early failures and improve the long-term reliability of the devices. MSL is responsible for providing the oven and interfacing between the test board and the control board.
- Advanced control with high-performance PLC with PID regulation.
- Remotable graphical interface on PC or mobile device.
- Flexible communication: Modbus TCP standard, OPC UA, EtherCAT, and SQL.
- Secs-Gem Comunication to interface Host server with equipment HSMS comunication.
- Remote assistance with Ethernet or mobile connection, using a smartphone connected with USB.
- Data and alarm management with a dedicated FTP server for log saving.
- Automatic door closure.
