Wafer Technoven

Static oven with positive temperatures and controlled cooling.

FULLY CUSTOMIZABLE Wafer Technoven

Wafer Technoven

Static oven with positive temperatures and controlled cooling.

Clima & Thermotemperature range

From Ambient to 450° C

Characteristics
Hot Hot
Capacity
125L 250L 500L 2 x 125L 2 x 500L 1000L
Options
Customizable according to your needs:
  • Programming of thermal cycles with I/O customizable according to customer requirements.
  • Possibility of AMS2750 certification up to Class 1 for the aerospace industry.
  • Cooling with refrigeration unit or water for cycle time savings.
Characteristics
Equipment designed to use in the semiconductor industry, these systems ensure a clean environment for performing thermal processes. Heating occurs indirectly: the air is conditioned and circulated around the treatment chamber. Inside, the flow of dry air or nitrogen ensures a contamination-free environment.
  • Temperature control with digital electronic PID regulators.
  • Remotable graphical interface on PC or mobile device.
  • Flexible communication: Modbus TCP standard, OPC UA, SQL.
  • Secs-Gem Comunication to interface Host server with equipment HSMS comunication.
  • Remote assistance with Ethernet or mobile connection, using a smartphone connected with USB.
  • Data and alarm management with dedicated FTP server for log saving.
  • Internal atmosphere control.
  • Chamber designed for clean applications, built for easy cleaning of the work volume.
Ask an expert
Clima & Thermotemperature range

From Ambient to 450° C

Characteristics
Hot Hot
Capacity
125L 250L 500L 2 x 125L 2 x 500L 1000L
Options
Customizable according to your needs:
  • Programming of thermal cycles with I/O customizable according to customer requirements.
  • Possibility of AMS2750 certification up to Class 1 for the aerospace industry.
  • Cooling with refrigeration unit or water for cycle time savings.
Characteristics
Equipment designed to use in the semiconductor industry, these systems ensure a clean environment for performing thermal processes. Heating occurs indirectly: the air is conditioned and circulated around the treatment chamber. Inside, the flow of dry air or nitrogen ensures a contamination-free environment.
  • Temperature control with digital electronic PID regulators.
  • Remotable graphical interface on PC or mobile device.
  • Flexible communication: Modbus TCP standard, OPC UA, SQL.
  • Secs-Gem Comunication to interface Host server with equipment HSMS comunication.
  • Remote assistance with Ethernet or mobile connection, using a smartphone connected with USB.
  • Data and alarm management with dedicated FTP server for log saving.
  • Internal atmosphere control.
  • Chamber designed for clean applications, built for easy cleaning of the work volume.
Ask an expert
WAFER TECHNOVEN R1
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